| abstract |
The present invention provides a tetracarboxylic acid diester compound which can be derived as a polymer of a polyimide precursor used as a base resin of a negative photosensitive resin composition capable of forming a fine pattern and having a high resolution, and provides the use thereof. Polymer of polyimide precursor obtained from the tetracarboxylic diester compound and its manufacturing method. A tetracarboxylic diester compound characterized by the following general formula (1). In the formula, X 1 is a tetravalent organic group, and R 1 is a group represented by the following general formula (2). In the formula, the dotted line represents a bond, Y 1 is a (k + 1) -valent organic group, Rs is a group containing at least one silicon atom, k represents 1, 2, or 3, and n represents 0 or 1. |