| abstract |
Improved diimide and polyimide oligomers containing phenylacetylene terminal groups have been produced which melt at low temperatures and are curable into useful laminating resins, molding compounds and matrix resins. These oligomers are analogous to diimides and polyimides made from conventional dianhydrides, such as benzophenonetetracarboxylic dianhydride or pyromellitic dianhydride. |