| abstract |
A method of providing selective deposition. Some methods describe providing a first substrate surface; providing a second substrate surface; depositing a first film layer on the first and second substrate surfaces, wherein depositing on the second substrate surface has a hatching delay such that the first substrate surface The first film layer is thicker than the first film layer deposited on the surface of the second substrate; and etching the first film layer on the surfaces of the first and second substrates, wherein the first film layer on the surface of the second substrate is at least substantially It is removed, but the first film layer on the first substrate is only partially removed. |