| abstract |
(A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) silica, and (E) an epoxy resin composition containing alumina and / or aluminum hydroxide as essential components, the aluminum In the epoxy resin composition, the element content is 0.25 wt% or more and 5 wt% or less, and silica having an average particle size of 25 μm or less occupies 70 wt% or more of the total silica. According to the semiconductor sealing epoxy resin composition and the semiconductor device in which a semiconductor element is sealed using the epoxy resin composition, the semiconductor device has excellent reliability during high-temperature operation. |