| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and has excellent moldability, flame retardancy, high-temperature storage characteristics, moisture resistance reliability and solder crack resistance. Providing things. SOLUTION: An essential component is (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) aluminum hydroxide. 0.5 to 14 μm, the maximum particle size is 100 μm or less, and the particle size is 10 μm or less is 30% by weight or more. An epoxy resin composition for encapsulating a semiconductor, wherein 5% by weight or less is 5% by weight or more and 1 μm or less is 50% by weight or less. |