| abstract |
[PROBLEMS] For sealing, which satisfies the characteristics of a molding material for sealing in terms of surface smoothness, and gives a cured product excellent in adhesion to an adherend, toughness, and moisture resistance reliability. A molding material is provided. An epoxy resin, a resin obtained by reacting a phenoxy resin with a carboxyl group-containing butadiene elastomer, a curing agent for an epoxy resin, a curing agent for a phenoxy resin, A molding material for sealing comprising an inorganic filler having an average particle size of 0.1 to 15 μm and an organic solvent as essential components. |