| abstract |
An epoxy resin for semiconductor encapsulation that has excellent flame retardancy without using a conventional flame retardant, has excellent moldability and solder crack resistance, and has excellent high-temperature storage characteristics and electrical humidity resistance. Obtain the composition. SOLUTION: An epoxy resin, (B) a phenol resin, (C) an inorganic filler, and (D) a curing accelerator represented by the general formula (1) are essential components. (C) the content of the inorganic filler is 70 to 92% by weight, (D) the content of the curing accelerator represented by the general formula (1) is 0.05 to 0.5% by weight, and the content of the halogen atom is An epoxy resin composition for semiconductor encapsulation, wherein the content is 15 ppm or less and the content of antimony atoms is 75 ppm or less. (R1 to R4 in the formula each represent a substituent selected from the group consisting of an organic group containing a monovalent aromatic ring and a monovalent aliphatic residue, and may be the same or different. Represents a number satisfying 0 ≦ m ≦ 2.) |