http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003277585-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2002-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57c4cf158e85fe22c1d69f400e74ad8e |
| publicationDate | 2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003277585-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) Abstract: A semiconductor element having a protruding electrode on a circuit surface is electrically connected to a circuit board via the protruding electrode, and has excellent filling properties in a gap between the circuit board and the protruding electrode. Another object of the present invention is to provide an epoxy resin composition having a small warpage of a semiconductor device after molding or soldering and having excellent resistance to solder cracking. SOLUTION: (A) an epoxy resin represented by the formula (1), (B) a phenol resin represented by the general formula (2), An epoxy resin composition comprising (C) a spherical inorganic filler and (D) a curing accelerator as essential components, wherein the phenolic resin represented by the general formula (2) accounts for 30 to 10 of all phenolic resins. 0% by weight, the spherical inorganic filler is 70 to 88% by weight in the total epoxy resin composition, and the average particle size of the spherical inorganic filler is 0.5 to 10 μm, and the particle size of the spherical inorganic filler is Those having a particle size of 24 μm or more have a particle diameter of An epoxy resin composition for encapsulating a semiconductor, wherein the content of the epoxy resin is at least 20 μm and less than 24 μm. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013075939-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006117711-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9349714-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7372933-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5019251-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4645147-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006011662-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014152302-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8084520-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101287712-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006022239-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006011662-A1 |
| priorityDate | 2002-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.