| abstract |
The epoxy resin molding material for sealing of the present invention contains (A) an epoxy resin and (B) a curing agent, and (A) the epoxy resin contains a compound represented by the following general formula (I). As a result, it is excellent in reliability such as flame retardancy, moldability, reflow resistance, moisture resistance and high-temperature storage characteristics, and is suitable for sealing VLSI, and is sealed with this molding material. Provided is an electronic component device including the element. (R 1 in general formula (I) is selected from a substituted or unsubstituted hydrocarbon group having 1 to 12 carbon atoms and a substituted or unsubstituted alkoxy group having 1 to 12 carbon atoms, all of which are the same or different. N represents an integer of 0 to 4. R 2 is selected from a substituted or unsubstituted hydrocarbon group having 1 to 12 carbon atoms and a substituted or unsubstituted alkoxy group having 1 to 12 carbon atoms. All may be the same or different, and m represents an integer of 0 to 6.) |