| abstract |
(57) [Problem] To provide a resin-encapsulated semiconductor device in which the molding curability of an encapsulating material is not affected by moisture absorption conditions and is excellent in reflow resistance, moisture resistance, high-temperature storage characteristics and the like. In a resin-sealed semiconductor device sealed with an epoxy resin composition, the curing accelerator has a general formula (1): (Wherein the alkyl group in R m R is C 1 -C 4, m is an integer of 1 to 3, X is P- benzoquinone shows a) an epoxy resin composition containing an organic phosphorus compound represented by A resin-sealed semiconductor device characterized by being sealed. |