| abstract |
(57) Abstract: An epoxy resin composition for encapsulation having a low elastic modulus, a small warpage, excellent in moisture resistance reliability and thermal shock resistance, and exhibiting flame retardancy irrespective of the use of a halogen-based flame retardant, and Thus, an electronic component device having a sealed element and / or a bonding area is provided. (A) an epoxy resin, (B) a curing agent, (C) A flexible agent having a reactive functional group at a terminal, (D) a flame retardant and (E) an inorganic filler are essential components, and the halogen content is 0.01% by weight with respect to the epoxy resin composition for sealing. % An electronic component device having the following epoxy resin composition for sealing and an element and / or a bonding area sealed with the epoxy resin composition for sealing. |