| abstract |
PROBLEM TO BE SOLVED: To provide a non-halogen, non-antimony epoxy resin material for encapsulation having good flame retardancy without deteriorating reliability such as moldability, reflow resistance, moisture resistance, and high-temperature storage characteristics. , And an electronic component device provided with an element sealed thereby. SOLUTION: (A) an epoxy resin, (B) a curing agent, (C) An epoxy resin molding material for sealing having a composite metal hydroxide as an essential component and having a disk flow of 80 mm or more, and an electronic component device provided with an element sealed with the epoxy resin molding material for sealing . |