| abstract |
(57) [Summary] [Problem] A semiconductor that can achieve flame retardancy with non-halogen and non-antimony, has good moldability such as fluidity, and has excellent reliability such as reflow crack resistance, moisture resistance and high temperature storage characteristics. Provided is an epoxy resin molding material for sealing. (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a compound having two or more phenolic hydroxyl groups in one molecule; (C) a compound having the following formula (I): 1) (Eight Rs in the formula represent an alkyl group having 1 to 4 carbon atoms, All may be the same or different. Ar represents an aromatic ring. (D) a compound containing 5 to 20% by weight of a nitrogen atom, (E) a molding material containing an inorganic filler as an essential component, and a content of the components (C) and (D). However, the amount of the phosphorus atom is 0.2 to 3.0% by weight, and the amount of the nitrogen atom is 0.2 to 10.0% by weight, based on the total amount of the components except the filler (E). %. (E) The content of the component is 70% by weight based on the whole molding material. An epoxy resin molding material for encapsulating electronic parts, characterized in that: |