| abstract |
Epoxy molding compound for semiconductor devices with thin, multi-pin, long wires, narrow pad pitch or semiconductor chips arranged on a mounting substrate with excellent fluidity, and the flow of encapsulated wire, voids, etc. Provided is a semiconductor device in which a semiconductor chip is arranged on a thin, multi-pin, long wire, narrow pad pitch, or mounting substrate with less occurrence of molding defects. (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) an epoxy resin molding material for encapsulation containing a phosphoric acid ester as an essential component, and sealing by this. Semiconductor device stopped. |