| abstract |
An epoxy resin composition for semiconductor encapsulation having excellent flame retardancy without containing a halogen-based flame retardant and an antimony compound and having excellent moldability, solder resistance and high-temperature storage characteristics can be obtained. . A phenol aralkyl type epoxy resin having a biphenylene skeleton, (B) a phenol aralkyl resin having a biphenylene skeleton, (C) a curing accelerator, (D) an inorganic filler, and (E) a phosphoric acid ester compound, An epoxy resin composition for semiconductor encapsulation, wherein the acid ester compound accounts for 0.05 to 5% by weight of the total epoxy resin composition. |