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filingDate 1996-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1998-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H1045874-A
titleOfInvention Resin composition for semiconductor encapsulation
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in fluidity, warpage characteristics, and high-temperature storage characteristics. (A) an epoxy resin of the following formula (E-1), (B) a phenol resin curing agent of the following formula (H-1), (C) A resin composition for semiconductor encapsulation comprising: a curing accelerator represented by the following formula (C-1); and (D) an inorganic filler. Embedded image Embedded image Embedded image
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