abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in fluidity, warpage characteristics, and high-temperature storage characteristics. (A) an epoxy resin of the following formula (E-1), (B) a phenol resin curing agent of the following formula (H-1), (C) A resin composition for semiconductor encapsulation comprising: a curing accelerator represented by the following formula (C-1); and (D) an inorganic filler. Embedded image Embedded image Embedded image |