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filingDate 2000-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001226563-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation, which has less mold contamination, and is excellent in releasability, moisture resistance and solder crack resistance. SOLUTION: (A) Epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) inorganic filler, and (E) urethane-ized microcrystalline wax and polyethylene oxide are essential. An epoxy resin composition for encapsulating a semiconductor, comprising: a component.
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