abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation, which has less mold contamination, and is excellent in releasability, moisture resistance and solder crack resistance. SOLUTION: (A) Epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) inorganic filler, and (E) urethane-ized microcrystalline wax and polyethylene oxide are essential. An epoxy resin composition for encapsulating a semiconductor, comprising: a component. |