| abstract |
(57) [Problem] To provide an epoxy resin composition excellent in storage stability during storage, and also excellent in curability and cured product characteristics, and a highly reliable semiconductor device obtained by using the same. I do. A semiconductor device is obtained by encapsulating a semiconductor element using an epoxy resin composition containing the following components (A) to (E). (A) Epoxy resin. (B) a phenolic resin. (C) A hardening accelerator-containing microcapsule having a core / shell structure in which a core made of a hardening accelerator is covered with a shell made of a thermoplastic resin. (D) Rubber particles. (E) an inorganic filler. |