| abstract |
(57) [Summary]nA one-part curable epoxy adhesive composition is provided. The adhesive comprises a curable epoxy resin, (a) at least one first curing agent encapsulated in thermoplastic polymer microcapsules, and (b) a second latency mixed within the curable epoxy resin. A latent hardener system comprising a hardener, and a particulate thermoplastic polymeric material sufficient to at least locally plasticize the cured epoxy resin, provided by the microcapsule wall to all of its weight. A good granular thermoplastic polymer material. Also provided is a method of curing an adhesive by heating a composition. Also provided are joints made by bonding the components together with the adhesive composition and methods of making the joints. |