| abstract |
The present invention provides a silicone resin composition that provides a cured product having excellent moldability, curability, storage stability, particularly long-term heat resistance, and good crack resistance. (A) 70 to 99 parts by mass of thermosetting organopolysiloxane represented by the following average composition formula (1) and having a weight average molecular weight (polystyrene equivalent) of 1,000 to 20,000, (CH 3 ) a Si (OR 1 ) b (OH) c O (4-abc) / 2 (1) (wherein R 1 is an alkyl group having 1 to 4 carbon atoms, and a, b and c are 0.8 ≦ a ≦ 1.5, 0 ≦ b ≦ 0.3, 0.001 ≦ c ≦ 0.5, and 0.801 ≦ a + b + c <2.) (B) expressed by the following formula (2) 1 to 30 parts by mass of an organopolysiloxane having a linear diorganopolysiloxane unit, (C) A silicone resin composition comprising 50 to 900 parts by mass of an inorganic filler and (D) 0.3 to 8.0 parts by mass of a curing accelerator as essential components. [Selection figure] None |