| abstract |
PROBLEM TO BE SOLVED: To provide a curable silicone composition having good handling workability and forming a cured product having a low elastic modulus. (A) General formula: X—R 2 — (R 1 2 SiO) m R 1 2 Si—R 2 —X {wherein R 1 has 6 carbon atoms not having an aliphatic unsaturated bond. The following monovalent hydrocarbon group, R 2 is an alkylene group, X is an average unit formula: (YR 1 2 SiO 1/2 ) a (SiO 4/2 ) b (wherein R 1 is the same as above, Y Is a single bond, a hydrogen atom, the R 1 , an epoxy group-containing alkyl group, an alkoxysilylalkyl group, or an alkyl group having 7 or more carbon atoms, provided that at least one Y in one molecule is a single bond, at least one Y is an alkyl group having 7 or more carbon atoms, a and b are positive numbers, and a / b is a number of 0.2 to 4.0), the R 1 or alkenyl group, Provided that at least one X is an organopolysiloxane residue, m is an integer of 1 or more} and (B) Curable silicone composition consisting of epoxy resin curing agent. [Selection figure] None |