| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-06 |
| filingDate |
1994-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2b75c99fda4e28000da74a45b571a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c01999fcbb60f8069c53c92af1a70a40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d022b7100894971a5869a936724688a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8382dcfccd21e057d82364e7dd58007 |
| publicationDate |
1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08157744-A |
| titleOfInvention |
Photosensitive resin composition and photosensitive element using the same |
| abstract |
(57) [Summary] [Purpose] Photosensitive resin composition and photosensitivity with less contamination of the plating solution because the resist line width is not thick and the photosensitivity is high, and the photoinitiator is hardly eluted into the plating solution. Provide the element. [Structure] (A) Polymer 40 Having Carboxyl Group ˜80 parts by weight, (B) 20-60 parts by weight of a polymerizable compound having at least one unsaturated bond (so that the total amount of (A) and (B) is 100 parts by weight), C) General formula (I) (Wherein R 1 represents an alkylene group having 6 to 12 carbon atoms) in an amount of 0.05 to 1 part by weight (as described above). (Based on 100 parts by weight of (A) and (B)) and (D) A photosensitive resin composition containing 0.1 to 3.0 parts by weight of hexaarylbiimidazole (based on the total amount of 100 parts by weight of (A) and (B)) and the above-mentioned photosensitive material on a support film. A photosensitive element formed by laminating layers of a resin composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7687224-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002182385-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002148797-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002082434-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7517636-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013117581-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006057385-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0192958-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011028165-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4489918-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7645561-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008015754-A1 |
| priorityDate |
1994-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |