| abstract |
Disclosed is a photosensitive resin composition containing a polymer (A) having a carboxyl group, a hexaarylbiimidazole compound (B) having no halogen atom, a hydrogen-donating compound (C), and a photopolymerizable compound (D) having an acryl group or a methacryl group. The photosensitive resin composition is able to satisfy sufficiently high photosensitivity and sufficiently high resolution at the same time even though the components such as the photopolymerization initiator do not contain a halogen atom. In addition, the photosensitive resin composition enables to obtain a cured product having sufficiently excellent solder heat resistance. |