| abstract |
(57) [Summary] [Structure] A compound obtained by reacting cyclotriphosphazene, cyclotetraphosphazene or a derivative thereof with P-hydroxybenzaldehyde has a hydroxyl group obtained by reacting a phenol with an acid catalyst. A compound, an epoxy compound obtained by epoxidizing the hydroxyl group thereof, a resin composition containing the compound having the hydroxyl group and / or an epoxy compound, and a cured product thereof. [Effect] When the compound of the present invention is used, a cured product having extremely high heat resistance is obtained, and it can be mainly used as a resin for encapsulation of electric and electronic parts, a resin for laminating and the like. |