http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001335679-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate | 2000-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20b0512340a09710bece4542f86e2ff0 |
publicationDate | 2001-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2001335679-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and is excellent in curability, flame retardancy, high-temperature storage characteristics and solder crack resistance. thing. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, (E) a metal hydroxide solid solution represented by the general formula (1), and (F) ) An epoxy resin composition for semiconductor encapsulation, comprising a phosphazene compound as an essential component. Mg 1-x M 2+ x (OH) 2 (1) (where M 2+ is Mn 2+ , Fe 2+ , Co 2+ , Ni 2+ , C represents at least one divalent metal ion selected from the group consisting of u 2+ and Zn 2+ , and x represents a number satisfying 0.01 ≦ x ≦ 0.5) |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1302070-C http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003206394-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102030968-A |
priorityDate | 2000-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.