http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002317101-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 |
| filingDate | 2001-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f89e39c43434b43f0434333b1a89199d |
| publicationDate | 2002-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002317101-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Summary]nPROBLEM TO BE SOLVED: To contain a halogen-based flame retardant and an antimony compound. No moldability, flame retardancy, high temperature storage characteristics, moisture resistance reliability, semi-resistance To provide an epoxy resin composition for semiconductor encapsulation with excellent properties That.nSOLUTION: (A) Epoxy resin, (B) phenol Resin, (C) curing accelerator, (D) inorganic filler, (E) 1 0.7 × 10 melt viscosity at 50 ° C -2 ~ 5 × 10 -2 Pa ・ Semiconductor containing a phosphazene compound as an essential component It is an epoxy resin composition for sealing. |
| priorityDate | 2001-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.