| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent moldability, flame retardancy, high-temperature storage characteristics, moisture resistance reliability, and solder cracking properties. Providing a composition. SOLUTION: An essential component is (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, (E) a phosphazene compound, and (F) zinc molybdate. Characteristic epoxy resin composition for semiconductor encapsulation. |