| abstract |
(57) Abstract: An epoxy resin material for sealing which is non-halogen, non-antimony, has good flame retardancy, is excellent in moldability such as fluidity and adhesiveness, and has low moisture absorption. Provided is an electronic component device including a stopped element. (A) an epoxy resin, (B) a curing agent, (C) The cyclic phosphazene compound represented by the following general formula (I) and (D) an inorganic filler are essential components, and the amount of the component (C) is based on the total amount of the components except the inorganic filler (D). On the other hand, the amount of phosphorus atoms is 0.5 to 5% by weight, (D) A sealing epoxy resin molding material having a compounding amount of 70% by weight or more with respect to the sealing epoxy resin molding material, and an element sealed with the sealing epoxy resin molding material. Electronic component equipment. Embedded image (Here, any one or two of X 1 to X 6 is a hydroxyl group and the others are hydrogen atoms.) |