| abstract |
The invention relates to an apparatus for applying plasma to at least one substrate (7). The apparatus comprises a first electrode (1) and a second electrode (12) which can be arranged to face the first electrode, the first electrode and the second electrode (1, 12) being cooperative. And configured to form a plasma between the electrodes (1, 12), and at least one of the first electrode and the second electrode (1, 12) includes at least two electrode units (2, 12). 3). The invention further relates to a corresponding method. |