| abstract |
The present invention has sufficient alkali solubility, can be cured at a temperature of 300 ° C. or less, has excellent cured film elongation, and can form a pattern with a thick film (about 10 μm). A photosensitive resin having a high residual film ratio upon curing and a good shape of the cured relief pattern, a method of forming a cured relief pattern using the photosensitive resin, and the cured relief pattern It is an object to provide a semiconductor device and a display device. A photosensitive resin composition containing (A-1) a resin containing a structure represented by the following general formula (1) and (B) a photoacid generator is provided. {In Formula (1), X, R1 to R7, m1 to m4, n1, n2, Y, and W are as defined in the specification, respectively} |