| abstract |
A positive type photoresist which has excellent heat resistance, sensitivity and resolution, has a high resist stripping rate with ozone water, can be developed with an aqueous alkali solution, and does not easily generate scum, which is a residual residue of the resist during development. provide. The present invention comprises an easily ozonolytic and alkali-soluble novolak resin (A), a quinonediazide group-containing photosensitizer (B), a hardly ozonolytic and alkali-soluble resin or oligomer (C). A positive photoresist is provided. [Selection figure] None |