http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021117586-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8205ec6ee1cd95eb60a03826535bad97 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12 |
| filingDate | 2020-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a580db05ecb182dae46e81b0f562d39 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0790d013218abfcc044af374604f8282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b946eab539dd527dc8c7219008be788c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64643464c064e73d5eb5c1105c8bb26f |
| publicationDate | 2021-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2021117586-A1 |
| titleOfInvention | Photosensitive insulating film-forming composition |
| abstract | Provided are: a negative photosensitive insulating film composition that gives a cured body for which the initial dielectric tangent is low and changes over time are small; a method for manufacturing a cured relief pattern-equipped substrate by using the negative photosensitive insulating film composition; and a semiconductor device provided with the cured relief pattern. The negative photosensitive insulating film composition contains: (A) a polyimide precursor having a unit structure represented by general formula (1): [in the formula, X1 is a tetravalent organic group, Y1 is a divalent organic group, and R1 and R2 are each independently a hydrogen atom or a group represented by general formula (2): (in the formula, R3, R4 and R5 are each independently a hydrogen atom or a monovalent organic group, and m is an integer from 1 to 10. * is a site of bonding to a carboxylic acid present in the main chain of the poly(amic acid) of general formula (1)]; and (B) an isocyanate compound represented by general formula (20): [in the formula, R23 denotes a hydrogen atom or a methyl group, R24 denotes an alkylene group, and R25 denotes an isocyanate group or a blocked isocyanate group.] |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I786979-B |
| priorityDate | 2019-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 810.