| abstract |
Provided is a cleaning method for improving a cleaning process that easily induces pattern collapse in a method of manufacturing a wafer having a concavo-convex pattern on a surface. A method of cleaning a wafer having a concavo-convex pattern on a surface, wherein at least the step of cleaning the wafer with a cleaning liquid, the step of replacing the cleaning liquid held in the concave portion of the wafer after cleaning with a water repellent chemical, A step of drying, wherein the cleaning liquid contains 80% by mass or more of a solvent having a boiling point of 55 to 200 ° C., and the temperature of the water-repellent chemical solution provided in the replacing step is 40 ° C. or higher. By making it less than the boiling point of the water-repellent chemical solution, at least the surface of the recess is made water-repellent. [Selection] Figure 4 |