| abstract |
Provided are a solder resist composition and a metal base circuit board in which cracks due to warping or twisting of a substrate are unlikely to occur in a solder resist layer even when highly filled with a white pigment. On an insulating layer and a conductor circuit of a metal base substrate, an epoxy resin having an epoxy equivalent of 200 to 2000, a hydrogenated bisphenol A to F type or a copolymer thereof, and a bisphenol having an epoxy equivalent of 200 to 10,000. Epoxy resin that is A-type to F-type or a copolymer thereof, the main chain includes a siloxane skeleton and a bisphenol A skeleton, the ratio of silicone in the main chain is 30 to 75% by mass, and the epoxy group is terminated One or two or more of the introduced epoxy resin, the epoxy resin having a main chain containing a hexamethylene glycol skeleton, a glycerin skeleton and a bisphenol A skeleton and having an epoxy group introduced at the terminal, or a polytetramethylene glycol type epoxy resin A solder resist layer is formed with the contained composition. [Selection] Figure 1 |