| abstract |
[PROBLEMS] To provide a cured product having excellent flexibility, solder heat resistance, heat deterioration resistance, and electroless gold plating resistance, and can be developed with an organic solvent or a dilute alkaline solution, for a solder resist and for an interlayer insulating layer. A resin composition suitable for A resin composition containing an unsaturated group-containing urethane compound (C) using an unsaturated group-containing polycarboxylic acid resin (A), a diluent (B), and spiroglycol (a) as a diol component. |