abstract |
A photosensitive resin composition having good dryness to touch and excellent electroless gold plating resistance, developability and gloss of a cured product, a cured film thereof, and a printed wiring board provided with the cured film. Provided are a photosensitive resin composition having good sensitivity, excellent in gold plating of a cured product, reduction in reflectance due to heat and light irradiation, and suppression of discoloration, a cured film thereof, and a printed wiring board including the cured product. A photosensitive resin composition comprising (A) an acid-modified photosensitive epoxy resin and (B) a non-photosensitive carboxylic acid resin having a styrene skeleton and having a weight average molecular weight of 10,000 to 50,000. It is a thing. The acid value of the (B) non-photosensitive carboxylic acid resin is preferably 120 mgKOH / g or more. A photosensitive resin composition comprising (α) an acid-modified photosensitive resin, (β) a non-photosensitive carboxylic acid resin having a styrene skeleton, and (γ) a colorant. [Selection figure] None |