| abstract |
A photosensitive resin composition for a black resist suitable for a thick film having good pattern dimensional stability, development margin, pattern adhesion, and sharpness of a pattern edge shape is provided. (A) an unsaturated group-containing compound obtained by further reacting a reaction product of an epoxy compound derived from a bisphenol with (meth) acrylic acid with a polybasic carboxylic anhydride; A copolymer obtained by polymerizing an N-substituted maleimide, an ethylenically unsaturated monomer having a carboxyl group, and a monomer mixture containing another ethylenically unsaturated monomer, wherein Mw is 7000 to 120,000 , An alkali-soluble resin having an acid value of 70 to 150 (KOH mg / g), (C) a photopolymerizable monomer having an ethylenically unsaturated bond, (D) a photopolymerization initiator, (E) a black organic pigment, and a mixed color organic. A photosensitive resin composition for a black resist comprising, as essential components, each component of a light-shielding dispersed pigment comprising a pigment or a light-shielding material. [Selection diagram] None |