| abstract |
(57) [Summary] (Modified) [Problem] The cured product has excellent flexibility, solder heat resistance, heat deterioration resistance, and electroless gold plating resistance, and can be developed with an organic solvent or a dilute alkali solution. Provided is a resin composition suitable for an interlayer insulating layer. A polyimide precursor (a) having a terminal anhydride group represented by the general formula (1) (Wherein, R 1 represents a tetravalent organic group having 2 to 30 carbon atoms, R 2 represents a divalent organic group having 2 to 240 carbon atoms, and n is an integer of 0 or 1 or more. ), And an oligomer (A) obtained by reacting a polyol compound (b) with a polysulfide-modified epoxy (meth) acrylate (c) as an optional component, and a diluent (B). |