abstract |
【Task】 To provide a cured film excellent in heat resistance, chemical resistance, adhesion to a substrate, transparency, flatness, resolution, and residual film ratio, and a composition for forming the cured film. [Solution] The composition of this invention contains the polyester amide acid which has a polymerizable double bond, the compound which has polymerizable double bonds other than this polyester amide acid, a photoinitiator, an epoxy compound, and an additive. The polyester amic acid having a polymerizable double bond can be obtained by reacting tetracarboxylic dianhydride, diamine, and polyvalent hydroxy compound as essential raw material components. [Selection figure] None |