| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 |
| filingDate |
2012-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c403aeb8534b229859c20d7a57c1b1b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_805c8023faf5b99603fd48ddcdedeb4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f74de609fa36253ccf171c3640beb6a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9b4e74a5786c6102777b0ca7534f310 |
| publicationDate |
2012-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012216770-A |
| titleOfInvention |
Anisotropic conductive paste and method of connecting electronic parts using the same |
| abstract |
An anisotropic conductive paste having sufficient repair properties and high connection reliability is provided. The anisotropic conductive paste of the present invention is an anisotropic conductive paste for connecting an electronic component and a wiring board. And the anisotropic conductive paste has a thermosetting resin composition containing 10% by mass to 50% by mass of lead-free solder powder having a melting point of 240 ° C. or less, and a thermosetting resin composition containing an organic acid. The acid value of the thermosetting resin composition is 15 mgKOH / g or more and 55 mgKOH / g. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180111640-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017203109-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5819026-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014189028-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020095634-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170038691-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015125779-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016088978-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5735716-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170038693-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170038692-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018028145-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9490046-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021309829-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018131569-A |
| priorityDate |
2011-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |