| abstract |
An anisotropic conductive paste that can sufficiently secure the adhesive strength of a connection portion and has high connection reliability is provided. An anisotropic conductive paste of the present invention is a thermosetting resin containing a lead-free solder powder having a melting point of 240 ° C. or lower and 10% by mass to 50% by mass, and a thermosetting resin and a curing agent. The composition contains 50% by mass or more and 90% by mass or less of the composition, and the curing agent contains a carboxylic acid curing agent, an imidazole curing agent, and an amine curing agent. [Selection figure] None |