http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5819026-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 |
| filingDate | 2015-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5819026-B1 |
| titleOfInvention | Method for manufacturing connection structure |
| abstract | Provided is a method for manufacturing a connection structure in which solder particles can be efficiently arranged on electrodes, and conduction reliability between the electrodes can be improved. The method for manufacturing a connection structure according to the present invention includes a step of disposing a conductive paste including a plurality of solder particles and a thermosetting component on the surface of a first connection target member, and the first of the conductive paste. On the surface opposite to the connection target member side, a step of arranging the second connection target member so that the first electrode and the second electrode face each other, and heating the conductive paste, A step of forming a connection portion connecting the first connection target member and the second connection target member with the conductive paste, and arranging the second connection target member and the connection In the step of forming the portion, no pressure is applied, and the weight of the second connection target member is added to the conductive paste. |
| priorityDate | 2014-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.