| abstract |
An object of the present invention is to provide a resin composition that can be cured even at a low temperature and can form an adhesive portion having sufficient conductivity and connection reliability. A resin composition comprising conductive particles, an epoxy resin, a phenoxy resin, and a curing agent, the solder particles being included as the conductive particles, wherein the epoxy resin is a bisphenol type epoxy resin or a phenol novolac type epoxy resin. A biphenyl type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, a triglycidyl isocyanurate, a cyclohexane type epoxy resin, an adamantane type epoxy resin, and the curing agent, A resin composition, which is one or more compounds selected from the group consisting of an epoxy resin amine adduct compound, an epoxy resin imidazole adduct compound, and a modified aliphatic polyamine compound. [Selection] Figure 1 |