| abstract |
An object of the present invention is to provide a curable resin composition capable of forming a solder resist film having flexibility and low warpage while preventing a decrease in reflectance due to aging and thermal history. (A-1) A copolymer resin obtained by reacting a compound of general formula (I) with a compound of general formula (II) and / or general formula (III), or (A-2) An oxirane ring and an ethylenically unsaturated bond are formed on a part of the carboxyl group of the copolymer obtained by reacting the compound of general formula (I) with the compound of general formula (II) and / or general formula (III). A curable resin composition comprising a copolymer resin to which a compound having an added compound, (B) a curing agent, and (C) a diluent are included. [Selection figure] None |