| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0274 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate |
2016-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101835462-B1 |
| titleOfInvention |
Liquid solder resist composition and printed wiring board |
| abstract |
The object of the present invention is to provide a liquid solder resist composition which can be formed on a solder resist layer having a glossy and highly smooth surface despite containing a powdery hydroquinone type epoxy compound. The liquid solder resist composition according to the present invention contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C) and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11). |
| priorityDate |
2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |