| abstract |
A thermosetting resin composition for controlling warping deformation of a substrate due to temperature change and a cured product thereof. 20 to 70 parts by weight of an epoxy resin, 5 to 20 parts by weight of a thermosetting agent, triphenylphosphine, acetal zinc, and 1,5,7-triazabicyclo [4.4.0] deca 5 A thermosetting resin composition comprising 0.01 to 20 parts by weight of a transesterification catalyst selected from ene, the viscosity is lowered at high temperature, the stress of the substrate due to temperature change can be reduced, and warping deformation The thermosetting resin composition which controls the curvature deformation of a board | substrate reduced. [Selection] Figure 1 |