| abstract |
A conductive base material capable of forming a conductive layer having high adhesion to a base material having a transparent conductive film and low resistivity even when fired at a low temperature. In a laminate composed of a substrate having a transparent conductive film, an adhesive layer formed on the transparent conductive film, and a coating film formed on the adhesive layer, the adhesive layer Is made of a thermoplastic resin, and the coating film is made of a conductive paste containing conductive particles, a binder resin and a dispersion medium. The thermoplastic resin may contain an aqueous polyester resin. The conductive particles may be metal colloid particles and metal fillers. The binder resin may be an epoxy resin. About 0.1-3 mass parts may be sufficient as the ratio of the said binder resin with respect to 100 mass parts of electroconductive particle. The conductive substrate of the present invention is obtained by firing this laminate at 150 to 300 ° C. [Selection figure] None |