http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015187976-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ca281a36dc88c033ae84728f46ecd5a3
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-36
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filingDate 2015-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d89771a0ba7a7fc174b202acc49af988
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b14cf525fce51b74471293fb47e690b0
publicationDate 2015-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015187976-A
titleOfInvention Conductive substrate, method for producing the same, and precursor
abstract An object of the present invention is to provide a conductive substrate on which a conductive film having high adhesion and low resistance to a polycarbonate substrate is formed. A conductive base material precursor is prepared by laminating a coating film containing silver nanoparticles and protective colloid containing silver colloid particles and a surface modifier on a polycarbonate base material. The maximum primary particle size of the silver nanoparticles is 200 nm or less, and the surface modifier is a dispersion medium having a hydroxyl group and an ether bond. The surface modifier may be an aliphatic hydrocarbon having a hydroxyl group and an ether bond in the molecule, and the boiling point may be about 100 to 300 ° C. The coating film may not contain a resin component. In the precursor of the present invention, an easy adhesion layer may not be interposed between the substrate and the coating film. A conductive base material is obtained by firing the precursor at 80 to 150 ° C. and forming a conductive film on the base material. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018154073-A
priorityDate 2014-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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