| abstract |
[PROBLEMS] To provide a printed wiring board substrate, a printed wiring board, which does not require a vacuum facility for manufacturing, does not use an organic adhesive, and can sufficiently reduce a conductive layer (copper foil layer). Another object is to provide a method for manufacturing a printed wiring board substrate. An insulating substrate, a first conductive layer laminated on the insulating substrate, and a second conductive layer laminated on the first conductive layer. A printed wiring board substrate, wherein the first conductive layer 12 is configured as a conductive ink coating layer containing metal particles, and the second conductive layer 13 is configured as a plating layer. is there. [Selection] Figure 1 |