| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1208 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2019-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_050f6e49c593c0ce06c128956e664739
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa4ec60f2080d3403672ff26bd80510c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_685f827b129d947e0237952b061240c8 |
| publicationDate |
2020-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020003880-A1 |
| titleOfInvention |
Multilayer body for printed wiring boards and printed wiring board using same |
| abstract |
The present invention provides: a multilayer body for printed wiring boards, which is characterized in that a metal particle layer (M1) and a photosensitive resin layer (R) are sequentially superposed on an insulating base material (A); or alternatively, a multilayer body for printed wiring boards, which is characterized in that a primer layer (B), a metal particle layer (M1) and a photosensitive resin layer (R) are sequentially superposed on an insulating base material (A). This multilayer body for printed wiring boards enables the achievement of a wiring line which has a rectangular cross-sectional shape suitable for circuit wiring lines, and which is less susceptible to undercut, while exhibiting good adhesion between a base material and a conductor circuit without requiring surface roughening by means of chromic acid or permanganic acid, formation of a surface modification layer by means of an alkali, and a vacuum apparatus. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022097484-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022097483-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7260065-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023286873-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2022097484-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2022097483-A1 |
| priorityDate |
2018-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |